Cadence Design Systems, Inc. is the global leader in software,
hardware, methodologies, and services that play essential roles
in accelerating innovation in today’s highly complex integrated
circuits, printed circuit boards, and electronics systems. Companies
use Cadence
® electronic design automation (EDA) technologies
and engineering services to design, verify, and prepare advanced
semiconductors and systems for manufacturing. These products, in
turn, form the foundation of consumer electronics, networking and
telecommunications equipment, and computer systems. 5,100 Cadence
employees at locations throughout the world—including China, India,
Europe, Russia, Israel, Japan, Korea, Taiwan, and North America—serve
our global customer base.
MARKETS
Cadence serves the more than $1 trillion worldwide electronics market,
which is increasingly being driven by consumer-oriented products.
The major vertical market segments include computers, wired and
wireless communications, and consumer electronics, such as multimedia
and personal entertainment devices. Globally, these account for 75
percent of electronics equipment revenue and more than 90 percent
of semiconductor revenue. The major horizontal segments are systems
companies, semiconductor companies, and silicon providers (ASIC
vendors, foundries, and FPGA companies). Cadence is a leading
provider of EDA solutions in each of these segments, giving the
company unparalleled visibility into the electronics design industry.
Two major trends drive electronics design—increasing silicon capacity
and converging market demands. Silicon capacity has been doubling
every 18-24 months for more than 30 years. Although what is known as
Moore’s Law continues, constraints such as power are now stretching the
limits of productivity, and there seems to be an end in sight.
Nonetheless, to meet market demands to converge computer,
communications, and consumer capabilities into a wide variety of
products—including cell phones, PCs, PDAs, flat panel HDTVs, set-top
boxes, wireless networks, and automobiles—electronics companies
need to invest continually to make the best use of this growing silicon
capacity. This means breaking down barriers between today’s separate
domains of embedded software, digital logic, analog circuits, and PCB
design to meet time-to-market pressures and demands for continued
evolution of device functionality. Cadence is the only company with the
combination of product line breadth, domain expertise, and vertical
design methodology experience to best address these challenges.
CADENCE DESIGN SOLUTIONS
Digital Design
The Cadence Encounter
® digital design platform accurately converts
the high-level logical specification of a digital integrated circuit (IC)
into a detailed physical blueprint and then detailed design information
showing how the IC will be physically implemented. This data is used
for the creation of the photomasks used in chip manufacture.
Custom Design
The Cadence Virtuoso
® custom design platform develops differentiated
System Interconnect
This product group consists of printed circuit board (PCB) and IC
package design products, including the Cadence Allegro
interconnect design platform, which enables co-design of advanced ICs,
IC packages, and PCBs.
® system
Functional Verification
The Cadence Incisive
increases quality by verifying that the high-level logical specification of an
IC design is correct. Employing the industry’s first single-kernel architecture,
the Incisive platform delivers the fastest, most efficient way to verify large,
complex chips. Cadence verification process automation enables customers
to manage their entire verification effort, which boosts productivity,
increases predictability, and ensures system-level quality.
® functional verification platform reduces risk and
Design For Manufacturing
Cadence design-for-manufacturing (DFM) solutions ensure that advanced
ICs will be manufacturable with high yields while also meeting aggressive
performance, power, and schedule requirements. These technologies help
customers analyze, optimize, and verify the physical implementation of a
design, taking into account a combination of rules and models that represent
manufacturing limits and variability of customers’ target processes. Cadence
DFM solutions enable customers to produce the lowest cost, most advanced
ICs while still meeting their time-to-market goals.
Cadence Kits
Cadence Kits help companies in the wired networking, wireless, and
multimedia sectors achieve shorter, more predictable design cycles
and greater productivity by simplifying the application and integration
of EDA technologies and verification intellectual property (IP). Each
Cadence Kit addresses application-specific design issues by combining
verified methodologies packaged in platform flows, and enabling
standards-based IP—all applied to a segment representative design and
delivered with applicability training.
silicon for ICs that must be designed at the transistor level, including
analog, radio frequency (RF), memories, high-performance digital
blocks, and standard cell libraries. Detailed design information showing
how the IC will be physically implemented is used for the creation of the
photomasks used in chip manufacture. The Virtuoso platform offers the
industry’s fastest, most silicon-accurate way to design custom analog,
RF, and mixed-signal ICs.